3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications

Konferenzbeitrag › Konferenzpaper › 2018

Zitation

Bickel, Jan; Ngo, Ha-Duong; et al.: 3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications. In: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Hg. von Fraunhofer Institute for Electronic Nano Systems ENAS. Dresden: Smart Systems Intergration 2018( 12), S. 100-105.

ISBN

978-3-95735-082-4

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