3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications
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Bickel, Jan; Ngo, Ha-Duong; et al.: 3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications. In: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Hg. von Fraunhofer Institute for Electronic Nano Systems ENAS. Dresden: Smart Systems Intergration 2018( 12), S. 100-105.
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A novel approach for 3D Chips Interconnection for Harsh Environment Applications
Smart Systems Integration 2018
Dresden, 11.04.2018Veranstaltungsbeitrag › Vortrag › 2018