Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS

Konferenzbeitrag › Konferenzpaper › 2018

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Ngo, Ha Duong; Hu, Xiaodong; Baeuscher, Manuel; Mackowiak, Piotr; Zhang, Yucheng; Wang, Bei; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Ehrmann, Oswin; Lang, Klaus-Dieter: Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS . In: Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS . Hg. von IEEE. Singapore: 2018( 2018), S. 200-204.

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