High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications

Konferenzbeitrag › Konferenzpaper › 2019

Zitation

Ngo, Ha Duong; Mackowiak, Piotr; Tschoban, Christian; Fritsche, Carola; Ndip, Ivan; Lang, Klaus-Dieter; Zoschke, Kai: High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications. In: High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications. Hg. von IEEE. USA: IEEE 2019, S. 1-6.

Zitieren

BibTeX / RIS