Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
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› 2019
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Konferenzbeitrag Full Paper
Ngo, H. D.; Bickel, J.; Eberl, M.-L.; Kaletta, K.; Schneider-Ramelow, M.; Lang, K.-L: Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications. In: Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications. Hg. von VDE. BERLIN: 2019, S. 1-4.