Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems

Konferenzbeitrag › Konferenzpaper › 2020

Zitation

Mackowiack, Piotr; Erbacher, Kolja; Schiffer, Michael; Ngo, Ha Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter: Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems. In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Hg. von IEEE. Tønsberg, Vestfold, Norway: 2020, S. 1-6.

ISBN

978-1-7281-6293-5 (online)

Link

10.1109/ESTC48849.2020.9229659

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