Harsh environment interconnection technology for three-dimensional packaging
Artikel › Journalartikel
› 2022
Zitation
Artikel
Bickel, Jan; Scherer, Joachim; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Ngo, Ha Duong: Harsh environment interconnection technology for three-dimensional packaging. In: iMaps Plus 2/2022, PLUS Elektronikfertigung. (2022), S. 1-2.