An advanced MEMS sensor packaging concept for use in harsh environments

Konferenzbeitrag › Konferenzpaper › 2013

Zitation

Ngo, Ha Duong; von Berg, Jochen; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter: An advanced MEMS sensor packaging concept for use in harsh environments. In: Proceeding of 15. Electronic Packaging Technology Conference. Hg. von IEEE. Singapore: IEEE 2013, S. 103-107.

ISBN

978-1-4799-2833-0

Link

http://www.eptc-ieee.net/

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