Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design

Konferenzbeitrag › Konferenzpaper › 2016

Zitation

Ehrmann, Oswin; Hu, Xiaodong; Meng, Maozhou; Lang, Klaus-Dieter; Mackowiak, Piotr; Mukhadhyay, Biswajit; Ngo, Ha Duong: Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Hg. von IEEE. Singapore: 2016, S. 325-330.

ISBN

978-1-5090-4368-2

Link

https://doi.org/10.1109/EPTC.2016.7861498

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