Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design
Veranstaltungsbeitrag › Sonstiger Veranstaltungsbeitrag › 2016
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Singapore, 30.11.2016 - 03.12.2016
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Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design
Konferenzbeitrag › Konferenzpaper › 2016