Suchergebnisse
Moving beyond natural resources as a source of conflict: Exploring the human-environment nexus of environmental peacebuilding.
Dresse, A; Nielsen, J. Ø.; Zikos, D.: Moving beyond natural resources as a source of conflict: Exploring the human-environment nexus of environmental peacebuilding., S. 1-22, Berlin, Germany, 2016
Piezoresistive Pressure Sensors for Applications in Harsh Environments—A Roadmap
Ngo, Ha Duong ; Ehrmann, Oswin ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter : Piezoresistive Pressure Sensors for Applications in Harsh Environments—A Roadmap. In: Modern Sensing Technologies, S. 231-251, Springer Nature Switzerland, 2018, ISBN 978-3-319-99539-7, ISSN 2194-8402
Platinum interconnections for harsh environment applications using atmospheric pressure sputtering
Bickel, Jan; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Gesche, Roland; Ngo, Ha Duong: Platinum interconnections for harsh environment applications using atmospheric pressure sputtering. In: 2022 International Conference on Electronics Packaging (ICEP), S. 167-168, IEEE, Japan, 2022, ISBN 978-1-6654-8469-5
3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications
Bickel, Jan ; Ngo, Ha-Duong ; et al. : 3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications. In: International Conference and Exhibition on Integration Issues of Miniaturized Systems, S. 100-105, Smart Systems Intergration, Dresden, 2018, ISBN 978-3-95735-082-4
Environmental and socio-economic feasibility assessment of rice straw conversion to power and ethanol in Thailand
Kami Delivand, Mitra; Mirko Barz; Shabbir H. Gheewala; Boonrod Sajjakulnukit : Environmental and socio-economic feasibility assessment of rice straw conversion to power and ethanol in Thailand. In: Journal of Cleaner Production, S. 29-41, 2012, ISSN 0959-6526
Platinum interconnections for harsh environment applications using atmospheric pressure sputtering
Bickel, Jan; Ngo, Ha Duong; Martin, Schneider-Ramelow; Klaus-Dieter, Lang; Roland, Gesche: Platinum interconnections for harsh environment applications using atmospheric pressure sputtering, S. E23-005-1-E21-005-11, Japan, 2023, ISSN 1884-8028 (online), 1883-3365 (print)
Hybrid environments for universities. A shared commitment to campus innovation and sustainability.
Ninnemann, Katja ; Liedtke, Bettina ; den Heijer, Alexandra ; Gothe, Kerstin ; Loidl-Reisch, Cordula ; Nenonen, Suvi ; Nestler, Jonathan ; Tieva, Åse ; Wallenborg, Christian : Hybrid environments for universities. A shared commitment to campus innovation and sustainability., S. 1-120, Waxmann, Münster, 2020, ISBN 978-3-8309-4179-8
COMITY - Conflict Avoidance in Pervasive Computing Environments
Majuntke (Tuttlies), Verena; Schiele, Gregor; Becker, Christian: COMITY - Conflict Avoidance in Pervasive Computing Environments. In: On the Move to Meaningful Internet Systems 2007: OTM 2007 Workshops: OTM Confederated International Workshops and Posters, AWeSOMe, CAMS, OTM Academy Doctoral Consortium, MONET, OnToContent, ORM, PerSys, PPN, RDDS, SSWS, and SWWS 2007, Vilamoura, Portugal, November 25-30, 2007, Proceedings, Part II, S. 763–772, Springer-Verlag, Berlin, Heidelberg, 2007, ISBN 978-3-540-76889-0
Advances in Environmental Informatics: Integration of Discrete Event Simulation Methodology with ecological Material Flow Analysis for Modelling eco-efficient systems
Page, Bernd ; Wohlgemuth, Volker : Advances in Environmental Informatics: Integration of Discrete Event Simulation Methodology with ecological Material Flow Analysis for Modelling eco-efficient systems. In: Procedia-Environmental Sciences, S. 745-754, Elsevier, Peking, 2010, ISSN 1878-0296
Into the Wild—A Methodology for Participatory Prototyping in Complex Environments
Reichert, Sara; Sumper, Andreas; Willner, Olga; Wessolek, Daniel; Sikora, Thomas: Into the Wild—A Methodology for Participatory Prototyping in Complex Environments. In: Springer, Human-Centred Technology Management for a Sustainable Future, S. 209-216, Springer, Berlin, 2025, ISBN 978-3-031-72490-9, ISSN 2198-7254