3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; J. Bickel: 3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications, S. 100-105, Dresden, 2018