High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; Mackowiak, Piotr; Tschoban, Christian; Fritsche, Carola; Ndip, Ivan; Lang, Klaus-Dieter; Zoschke, Kai: High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications. In: High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications, S. 1-6, IEEE, USA, 2019