Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; Bickel, Jan: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. In: Microelectronics and Packaging Conference 2019, S. 1-4, Barcelona, 2019