Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; Wilke, Martin; Wöhrmann, Markus; Gernhard, Robert; Zoschke, Kai; Schneider-Ramelow, Martin; Lang, Klaus-Dieter : Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB. In: Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB , S. 1-4, IEEE, Singapore, 2019