Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, H. D.; Bickel, J.; Eberl, M.-L.; Kaletta, K.; Schneider-Ramelow, M.; Lang, K.-L : Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications. In: Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications, S. 1-4, BERLIN, 2019