Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, H.-D.; Hu, X.; Schiffer, M.; Scneider-Ramelow, M.; Lang, K.-D.: Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices. In: Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices, S. 1-4, BERLIN, 2019