Passivation of textured silicon wafers: Influence of pyramid size distribution, a-Si:H deposition temperature, and post-treatment

Typ

Beitrag Zeitschrift von Prof. Dr. Bert Stegemann

Zitation

Stegemann, Bert ; Kegel, Jan ; Mews, Mathias ; Conrad, Erhard ; Korte, Lars ; Stürzebecher, Uta ; Angermann, Heike : Passivation of textured silicon wafers: Influence of pyramid size distribution, a-Si:H deposition temperature, and post-treatment. In: Energy Procedia, S. 881-889, 2013, ISSN 1876-6102

Homepage

http://dx.doi.org/10.1016/j.egypro.2013.07.360