Thermal Stress Analysis at Encapsulation and Backsheet Materials for PV-Modules

Typ

Beitrag Konferenzband von Prof. Dr. Bert Stegemann

Zitation

Wendlandt, Stefan ; Berthold, R. ; Stegemann, Bernd ; Sucherneck, Oliver ; Hanusch, Matthias ; Drobisch, A. ; Berghold, Juliane ; Schoppa, M. ; Krauter, S. ; Grunow, Paul : Thermal Stress Analysis at Encapsulation and Backsheet Materials for PV-Modules. In: Proceedings of the 31st European Photovoltaic Solar Energy Conference and Exhibition, Hamburg 2015, S. 2477-2481, WIP, München, 2015, ISBN 3-936338-39-6

Homepage

http://dx.doi.org/10.4229/EUPVSEC20152015-5CV.2.11