Stress-Free Bonding Technology with Bondable Thin Glass layer for MEMS based Pressure Sensor

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; Hu, Xiaodong; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.: Stress-Free Bonding Technology with Bondable Thin Glass layer for MEMS based Pressure Sensor. In: Conference Proceeding EPTC 2017, S. 100-104, Singapore, 2017, ISBN 978-1-5386-3041-9