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Advanced Control Engineering

Original Module NameVertiefung Regelungstechnik (ET)
Credits  |  Semester5 ECTS  |  Summer Semester 2018

Learning Outcomes and Competences:

Understanding the key concepts and methods of advanced control engineering, such as model-based design, pole placement, observer design, observer based state-space controller, and Kalman filter design. Ability to apply the methods to develop model-based control systems for real world problems.

- Review classic control methods
- Introduction in time discrete control
- Linear algebra review
- State-space models
 - Continuous-time linear state-space models
 - Discrete-time linear state-space models
 - Canonical forms
 - Controllability, observability
 - Pole placement method
 - Linear quadratic regulator approach
 - Observer design (full and reduced models)
 - Computer aided system design using Matlab
 - Controller validation with assessment criteria


Original Module NameElektronik (MST)
Credits5 ECTS  |  Summer Semester 2018


- Passive building elements: (discrete and integrated building elements), ohmic resistance, coil and capacity
- Semiconductor technologies: terms and principles of IC design and production, pn junction, semiconductor technologies
- Active building elements: bipolar transistor, CMOS transistor
- Principles of analogue technology: basic circuits, biasing, static and dynamic behaviour, 2-port network theory, simulation techniques


Credits 5 ECTS  

Students obtain basic knowledge on the analogies between biology and engineering. They are familiar with various kinds, methods, and applications of biosensors. They understand technologies and manufacturing steps of BioMEMS. A discussion of current research trends is an important part of this module. Students are enabled to contribute to microsystems engineering related tasks and projects in this area.

Advanced Microsystems Engineering

Credits 5 ECTS  

The course content can be divided into three main parts.


The first part is front-end-of-line technology:

- Overview of important semiconductors

- Properties of important semiconductors

- Fabrication of single crystal silicon wafers

- Clean room technology

- Cleaning technology

- Thin film deposition (thermal oxidation, CVD, PVD)

- Lithography

- Etching techniques for thin films

- Metallization and Ohmic contact to semiconductor

- Surface micromachining


The second part is focusing on volume micromachining:


- DRIE (Deep Reactive Ion Etching)

- HARMS (High Aspect Ratio Microstructures)

- 3D systems by using Wafer bonding technologies


The third part is focusing on Back-end-of-line technologies:

- Bonding


- Flip-chip