An advanced MEMS sensor packaging concept for use in harsh environments

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; von Berg, Jochen; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter: An advanced MEMS sensor packaging concept for use in harsh environments. In: Proceeding of 15. Electronic Packaging Technology Conference, S. 103-107, IEEE, Singapore, 2013, ISBN 978-1-4799-2833-0

Homepage

http://www.eptc-ieee.net/