Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ehrmann, Oswin; Hu, Xiaodong; Meng, Maozhou; Lang, Klaus-Dieter; Mackowiak, Piotr; Mukhadhyay, Biswajit; Ngo, Ha Duong: Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), S. 325-330, Singapore, 2016, ISBN 978-1-5090-4368-2

Homepage

https://doi.org/10.1109/EPTC.2016.7861498