Packaging solution for a novel silicon-based trace humidity sensor using coulometric method

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Mukhopadhyay, Biswajit; Mackowiak, Piotr; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Peter Herrmann,; Pohl, Olaf; Noack, Volker; Zhou, S.; Dao, Q. C.; Ngo, Ha Duong: Packaging solution for a novel silicon-based trace humidity sensor using coulometric method. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), S. 354-359, Singapore, 2016, ISBN 978-1-5090-4368-2

Homepage

https://doi.org/10.1109/EPTC.2016.7861504