Characterization of Anodic Bondable LTCC for Wafer-Level Packaging

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Hu, Xiaodong; Baeuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Hansen, U.; Maus, S.; Mackowiak, Piotr; Mukhopadhyay, Biswajit; Vokmer, N.; Ngo, Ha Duong: Characterization of Anodic Bondable LTCC for Wafer-Level Packaging. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), S. 501-505, Singapore, 2016, ISBN 978-1-5090-4368-2

Homepage

https://doi.org/10.1109/EPTC.2016.7861529