A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Fritz, Michael; Bäuscher, Manuel; Ngo, Ha Duong: A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer. In: Proceedings Smart Systems Integration, Cork, Ireland, 8 – 9 March 2017, S. 98-105, Cork, Ireland, 2017, ISBN 978-3-95735-057-2