A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer

Typ

Paper und Vortrag von/mit Prof. Dr.-Ing. Ha Duong Ngo

Veranstaltung

Smartsystems Integration, Cork, Ireland

Datum

8.3.2017 - 10.3.2017