Thermal Stress Analysis at Encapsulation and Backsheet Materials for PV-Modules

Konferenzbeitrag › Konferenzpaper › 2015

Zitation

Wendlandt, Stefan; Berthold, R.; Stegemann, Bernd; Sucherneck, Oliver; Hanusch, Matthias; Drobisch, A.; Berghold, Juliane; Schoppa, M.; Krauter, S.; Grunow, Paul: Thermal Stress Analysis at Encapsulation and Backsheet Materials for PV-Modules. In: Proceedings of the 31st European Photovoltaic Solar Energy Conference and Exhibition, Hamburg 2015. München: WIP 2015, S. 2477-2481.

ISBN

3-936338-39-6

Link

http://dx.doi.org/10.4229/EUPVSEC20152015-5CV.2.11

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