3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications

Typ

Beitrag Konferenzband von Jan Bickel

Zitation

Bickel, Jan; Ngo, Ha-Duong; et al.: 3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications. In: International Conference and Exhibition on Integration Issues of Miniaturized Systems, S. 100 - 105, Smart Systems Intergration, Dresden, 2018, ISBN ISBN 978-3-95735-082-4