Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

Typ

Beitrag Konferenzband von Jan Bickel

Zitation

J. Bickel, H.-D. Ngo, M. Schneider Ramelow, K.-D. Lang: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. In: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection, S. 1-5, IEEE, Pisa, 2019

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DOI: 10.23919/EMPC44848.2019.8951872