Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

Konferenzbeitrag › Konferenzpaper › 2019

Zitation

J. Bickel, H.-D. Ngo, M. Schneider Ramelow, K.-D. Lang: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. In: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. Hg. von IMAPS. Pisa, Italy: IEEE 2019, S. 1-6.

ISBN

978-1-7281-6291-1

Link

10.23919/EMPC44848.2019.8951872

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