A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer
Veranstaltungsbeitrag › Sonstiger Veranstaltungsbeitrag › 2017
Veranstaltung
Cork, Ireland, 08.03.2017 - 10.03.2017
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A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer
Konferenzbeitrag › Konferenzpaper › 2017