Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
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J. Bickel, H.-D. Ngo, M. Schneider Ramelow, K.-D. Lang: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. In: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. Hg. von IMAPS. Pisa, Italy: IEEE 2019, S. 1-6.
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Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Microelectronics and Packaging Conference 2019
Pisa, 16.09.2019Veranstaltungsbeitrag › Vortrag › 2019