Embedding of wearable electronics into smart sensor insole

Konferenzbeitrag › Konferenzpaper › 2016

Zitation

Hubl, Moritz; Pohl, Olaf; Noack, Volker; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Shin, E.; Ngo, Ha Duong: Embedding of wearable electronics into smart sensor insole. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Hg. von IEEE. Singapore: 2016, S. 354-359.

ISBN

978-1-5090-4368-2

Link

https://doi.org/10.1109/EPTC.2016.7861550

Sprache

Englisch

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BibTeX / RIS