Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

Artikel › Journalartikel › 2023

Zitation

Bickel, Jan; Ngo, Ha Duong; Martin, Schneider-Ramelow; Klaus-Dieter, Lang; Roland, Gesche: Platinum interconnections for harsh environment applications using atmospheric pressure sputtering. In: Trans. JIEP . (2023), S. E23-005-1-E21-005-11.

ISSN

1884-8028 (online), 1883-3365 (print)

Link

https://doi.org/10.5104/jiepeng.16.E23-005-1

Sprache

Englisch

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