Stress-Free Bonding Technology with Bondable Thin Glass layer for MEMS based Pressure Sensor
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Ngo, Ha Duong; Hu, Xiaodong; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.: Stress-Free Bonding Technology with Bondable Thin Glass layer for MEMS based Pressure Sensor. In: Conference Proceeding EPTC 2017. Singapore: 2017, S. 100-104.