Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS

Typ

Beitrag Konferenzband von Prof. Dr.-Ing. Ha Duong Ngo

Zitation

Ngo, Ha Duong; Hu, Xiaodong; Baeuscher, Manuel; Mackowiak, Piotr; Zhang, Yucheng; Wang, Bei; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Ehrmann, Oswin; Lang, Klaus-Dieter: Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS . In: Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS , S. 200-204, Singapore, 2018